CPU and chip cooler High Performance LGA775 cooler, cover, heatsink, CCL; RoHS

CPU and chip coolersActive cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. Through hole mounting with bore hole standoffs 2.7mm, 15mm fins, 24mm overall cooling height and integrated 12V fan

CPU and Chip CoolersPassive cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are M2.5 threaded.

CPU and chip coolersPassive cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are with 2.7mm bore hole.

CPU and Chip CoolersActive cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are M2.5 threaded, 15mm fins, 24mm overall cooling height and integrated 12V fan

CPU and Chip Cooler Active Cooler - pITX-imx8m

CPU and chip coolerStandard passive cooling solution for conga-JC370 (bore hole). 16mm fins, 21mm overall heat sink height and total height 26.3mm.

CPU and chip cooler Standard active cooling solution and integrated 12V fan for conga-JC370 (bore hole). 16mm fins, 21mm overall heat sink height and total height 27.3mm.

CPU and chip cooler Standard active cooling solution and integrated 12V fan for conga-JC370 (threaded). 16mm fins, 21mm overall heat sink height and total height 27.3mm.

CPU and chip cooler 1. 32-20809-0000-A0 2. CPU Cooler, R047, fan100%, 65'C 3. heat sink, 80x80x64.4mm 4. TIM: Greasc,X23-7762 5. Fan: 60x60x25mm, 49.4CFM, PWM 4 pin, 12V

CPU and Chip CoolerDC Chip Cooler, 45x45x10mm, 5VDC, Medium Speed, Hypro Bearing

CPU and chip coolerStandard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height * Cu = copper plate * T = M2.5 Threaded standoffs

CPU and Chip CoolerStandard active cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.

CPU and chip coolerStandard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.

CPU and chip cooler Passive cooling solution for SMARC 2.0 module conga-SMX8 with lidded NXP i.MX 8 ARM processor. All standoffs are with 2.7mm bore hole.

CPU and chip coolerStandard active cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins, 20mm overall heat sink height and integrated 12V fan * Cu = Copper plate * B = 2.7mm Bore hole standoffs

CPU and chip coolerStandard active cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins, 20mm overall heat sink height and integrated 12V fan * Cu = Copper plate * T = M2.5 threaded standoffs

CPU and chip coolerStandard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height * Cu = copper plate * B = Bore hole standoffs

CPU and chip coolerStandard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.

CPU & Chip CoolerPassive cooling solution for conga-IA5 based on open silicon Intel Pentium and Celeron processors with 12mm heatsink fins.