CPU and Chip CoolerStarterkit for SMARC 2.0 with SMARC module based on Intel Atom E3900 processor series. Includes congatec SMARC evaluation carrier board conga-SEVAL, SMARC module conga-SA5, cooling solution, adapters and cables.

CPU and chip cooler Passive cooling solution for Qseven module conga QA7 with open die Intel Pentium/Celeron J and N processors. All standoffs are M2.5mm thread.

CPU and chip cooler Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.

CPU and Chip Coolers

CPU and Chip Coolers

CPU and chip coolerStandard passive cooling solution for conga-JC370 (bore hole). 16mm fins, 21mm overall heat sink height and total height 26.3mm.

CPU and Chip Cooler Passive cooling solution for COM Express Compact module conga-TCA7 with open silicon Intel Pentium/Celeron J and N processors. All standoffs are with 2.7mm bore hole.

CPU and Chip CoolerStandard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

CPU and Chip Cooler Passive cooling solution for conga-PA7 based on open silicon Intel Pentium and Celeron J and N processors. All standoffs are M2.5 thread.

CPU and Chip CoolerStandard active cooling solution for high performance COM Express Type 7 module conga-B7XD with integrated heat pipes, 70mm radial 12V PWM fan and 30mm overall heat sink height. All standoffs are with 2.7mm bore hole.

CPU and chip coolerStandard passive cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height. All standoffs are with M2.5mm thread.

CPU and chip coolerStandard passive cooling solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 28mm height. All standoffs are with M2.5mm thread.

CPU and Chip CoolerPassive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole.

CPU and chip cooler Passive cooling solution for SMARC 2.1 module conga-SA7 with open-die Intel Pentium and Celeron J and N processorss. All standoffs are with 2.7mm bore hole.

CPU and chip coolerPassive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are with 2.7mm bore hole.

CPU and chip coolerStandard passive cooling solution for conga-JC370 (threaded). 16mm fins, 21mm overall heat sink height and total height 26.3mm.

CPU and Chip Cooler Passive cooling solution for COM Express Compact module conga-TCA7 with open silicon Intel Pentium/Celeron J and N processors. All standoffs are M2.5mm thread.

CPU and Chip CoolerPassive cooling solution for Qseven module conga QA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5mm thread.

CPU and chip coolerStandard active cooling solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are M2.5mm thread.

CPU and Chip CoolerPassive cooling solution for COM Express Mini Type10 module conga-MA7 with open-die Intel Pentium/Celeron N and J processors. All standoffs are M2.5mm threaded.